IHS Markit: supply chain challenges to impact global light vehicle production well into 2022
Green Car Congress
AUGUST 23, 2021
While front-end processing transforms a raw 200mm or 300mm silicon wafer into thousands of dice, each die needs to be packaged to provide a complete IC that can be soldered onto a circuit board to be part of an electronics control unit (ECU). Global Light Vehicle Production Forecast Implications. This represents an 8.3% million to 7.1
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