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U.S. Universities Are Building a New Semiconductor Workforce

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Universities and community colleges are revamping their semiconductor-related curricula and forging strategic partnerships with one another and with industry to train the staff needed to run U.S. Intel arrives at Ohio State Ohio State University is using its chip-fabrication facility to train future engineers and technicians.

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We’re the New Renewables

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Its creators, researchers at Gwangju Institute of Science and Technology, in South Korea, envision weaving such devices into fabrics so that someday our garments will double as power outlets for our ubiquitous portable electronic gadgets. The result: electrical current. Diana Gamzina, founder and CEO of Davis, Calif.,

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Memory Chips That Compute Will Accelerate AI

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Engineers at the second-largest DRAM makers and Purdue University unveiled results for Newton, an AI-accelerating HBM DRAM in 2020, but the company decided not to commercialize it and pursue PIM for standard DRAM instead. Icheon, South Korea–based SK hynix, the No. 2 DRAM supplier, is exploring PIM from several angles, says.

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BYU friction bit joining process bonds aluminum to cast iron

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Engineers at Brigham Young University (BYU) in Utah and the University of Ulsan in South Korea have used friction bit joining (FBJ) to bond dissimilar combinations of aluminum alloy A356 and grey cast iron. The process of friction bit joining uses a small, consumable bit to create a solid-state joint between metals.

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Hyundai Motor to invest $85B over next 10 years to accelerate transition to smart mobility provider

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The company is currently producing EVs in this way at its plants in the US, South Korea, the Czech Republic, and India. In addition, the company is expanding external collaborations with specialized companies, startups and universities. It plans to convert additional lines as market demand dictates.

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Who Really Invented the Thumb Drive?

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In 2000, at a trade fair in Germany, an obscure Singapore company called Trek 2000 unveiled a solid-state memory chip encased in plastic and attached to a Universal Serial Bus (USB) connector. In April 1999, the Israeli company M-Systems filed a patent application titled “Architecture for a Universal Serial Bus-based PC flash disk.”

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BASF and Samsung Heavy develop new anti-sloshing, anti-boil-off solution for LNG tankers

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The BASF/SHI anti-sloshing solution consists of a blanket of blocks of Basotect foam with buoys, which are stitched into Vectran textile covers and connected with Vectran belts. Click to enlarge. Above all, however, Basotect differs from other foams because it retains its properties even at extremely low temperatures.

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