Mitsubishi Electric introduces new power module for hybrid and electric vehicles
Green Car Congress
APRIL 7, 2011
Two carrier-stored trench gate bipolar transistor (CSTBT) IGBT chips are incorporated in a 600V/300A power module. Mitsubishi Electric’s J-Series T-PM offers enhanced reliability by incorporating the company’s original, inner connection technology called direct lead bonding (DLB). Sales will begin 8 April 2011.
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