Remove properties low-exothermic-epoxy-systems
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How a Dual Curing Adhesive Works

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Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. Nanosilica filled epoxy formulations are designed to further improve performance and processing properties. As a dual curing system, UV22DC80-1 cures readily upon exposure to UV light, and will cross link in shadowed out areas when heat is added.

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Adhesives Gain Popularity for Wearable Devices

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Product formulations include epoxies, silicones, epoxy-polyurethane hybrids, cyanoacrylates, and UV curing compounds. Because it is flexible and produces a lower exotherm — heat released during the polymerization process — than conventional epoxy systems, EP37-3FLF lessens the stress on sensitive electronic components during cure.

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EP29LPSP: Applications in Plasma Physics, Astronomy, and Highway Engineering

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Since its introduction in 1978, Master Bond EP29LPSP has been the epoxy compound of choice in a variety of challenging applications. Optically clear EP29LPSP has superior physical strength, electrical insulation, and chemical resistance properties. It also meets NASA low outgassing requirements and exhibits a low exotherm during cure.

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