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Infineon introduces first Trusted Platform Module specifically for automotive cybersecurity

Green Car Congress

A number of car manufacturers have already designed in Infineon’s OPTIGA TPM. As a computer on wheels, the connected car benefits from the experience of the IT industry. It is easy to integrate and substantially increases cybersecurity—from production to recycling of connected cars. The new OPTIGA TPM 2.0

ECC 334
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Infineon introduces next-generation of microcontroller multicore architecture for automotive applications

Green Car Congress

The new architecture is the foundation of Infineon’s next generation MCU family designed to meet the requirements of upcoming automotive powertrain and safety applications. The new multicore architecture contains up to three TriCore processor cores connected over a crossbar running at the full CPU speed and avoiding hardware contentions.

ECC 210
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Peugeot Shows Two HYbrid4 Concepts, New BB1 EV Concept at Frankfurt

Green Car Congress

Everything is managed electronically—there is no mechanical connection between the front and the rear. HDi FAP 120 kW (163 bhp) internal combustion engine, with a displacement of 1,997 cm 3 , was introduced this year and complies with the Euro 5 standard. The BB1 is based on a tubular chassis designed by Peugeot Motorcycles.

Concept 218
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Renesas introduces new microcontrollers for sensor fusion, gateway and chassis system applications

Green Car Congress

The new chips are designed for sensor fusion, gateway, and advanced chassis system applications that will enable the types of advanced systems envisioned in the car of the future. The R-Car SoCs would perform image recognition based on data from image sensors, and the connected RH850/P1x-C Series MCU would make judgments and apply control.

Fusion 210