AMD’s Next GPU Is a 3D-Integrated Superchip
Cars That Think
DECEMBER 6, 2023
AMD “It’s a truly amazing silicon stack up that delivers the highest density performance that industry knows how to produce at this time,” says Sam Naffziger , a senior vice president and corporate fellow at AMD. The integration is done using two TSMC technologies, SoIC (system on integrated chips) and CoWoS (chip on wafer on substrate).
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