Remove properties low-outgassing-adhesives
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How to Stake Electronic Components Using Adhesives

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adhesive staking. To achieve this, use a fine tip syringe with a high viscosity compound and apply the adhesive to each the four corners. You can apply the adhesive to the edge of the component, stake at multiple locations, or even apply the material around the entire component. staking approaches for the optimal outcome.

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EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies

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Unlike most two-part silver-filled adhesives, Master Bond EP21TDCS-LO uses a simple one-to-one mix ratio that remains workable for 30-40 minutes and cures at room temperature in 24-48 hours or in 1-2 hours at 200°F. Critical Properties. Bonding samples for extended ESD testing at low temperature and pressure. EP21TDCS-LO Role.

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EP29LPSP: Applications in Plasma Physics, Astronomy, and Highway Engineering

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Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. It also meets NASA low outgassing requirements and exhibits a low exotherm during cure.

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