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INFINITI selects 9 Internet of Things (IoT) and smart city startups for INFINITI LAB program in Canada

Green Car Congress

INFINITI LAB Toronto, an Internet of Things (IoT) and smart cities accelerator program from premium car brand INFINITI, announced the nine startups that will participate in the inaugural four-week accelerator program in Toronto. Pull is a mobile application that allows humans to connect to the internet of things. Rover Parking.

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Infiniti M35 Hybrid Features Original 1 Motor/2 Clutch Parallel Hybrid System

Green Car Congress

Infiniti unveiled its first production hybrid, the M35 Hybrid, at the 2010 Geneva Motor Show. The architecture of Nissan/Infiniti’s new parallel one motor/two clutch system. The ability to connect and disconnect the engine offers a number of benefits, Thunes said. ” —Toru Saito, Corporate VP, Infiniti.

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Nissan Outlines Fuel-Saving Technologies Launching in FY2010; New Engines, Transmission, Stop-Start System and Hybrid System

Green Car Congress

When the clutch is engaged, the engine, motor and wheels are directly connected, so the system also achieves responsive acceleration for sporty driving. The batteries are supplied by Automotive Energy Supply Corporation (AESC), a subsidiary jointly established by Nissan and NEC Corp. liter Engine with Dual Injectors. Earlier post.).

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Best electric scooters in India 2023

Electric Vehicles India

Designed to give customers a smart, connected and personalized commuting experience. Ather 450X Ather Energy is an Indian electric powered automobile corporation situated in Bangalore. The Bounce Infinity E1 is powered by a 1500-Watt BLDC motor. The Bounce Infinity E1 is powered by a 1500-Watt BLDC motor.

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AMD’s Next GPU Is a 3D-Integrated Superchip

Cars That Think

AMD “It’s a truly amazing silicon stack up that delivers the highest density performance that industry knows how to produce at this time,” says Sam Naffziger , a senior vice president and corporate fellow at AMD. The integration is done using two TSMC technologies, SoIC (system on integrated chips) and CoWoS (chip on wafer on substrate).

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