Remove applications bonding-ceramic-substrates
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Dow Corning and Delphi Automotive win R&D 100 award for silicone adhesive

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The adhesive is based on novel silicone chemistry that significantly expands design options for automotive electronics and other applications by enabling strong bonds to a wide variety of substrates. Depending on application, the material can often bond to these substrates without requiring pre-treatment or extensive cleaning.

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Adhesives Gain Popularity for Wearable Devices

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This is a sponsored article brought to you by Master Bond. Master Bond adhesive formulations provide solutions for challenging assembly applications in manufacturing electronic wearable devices. EP37-3FLF bonds well to a variety of substrates, including metals, composites, glass, ceramics, rubber, and many plastics.

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DENSO invests in semiconductor laser technology startup TriLumina; speeding up LiDAR adoption for ADAS, autonomous driving

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In our approach to VCSEL array technology we use flip-chip bonding that employs a sub-mount. Here, the VCSEL die is constructed in gallium arsenide, then flip-chip bonded to a ceramic or silicon sub-mount that has patterned metal on its surface. 2015) “High-speed and scalable high-power VCSEL arrays and their applications” Proc.

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Hyundai and Kia select Infineon HybridPACK 1 power module for current hybrid vehicle generations

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The HybridPACK 1 is a power module designed for mild hybrid applications for a power range up to 30 kW. The flat copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides optimized thermal cycling and power cycling reliability for mild hybrid inverter applications.

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Magna Electronics and Semikron Form a 50/50 Joint Venture for Power Electronics for Hybrid and Electric Vehicles

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that delivers electronic solutions to the automotive market, and Semikron, a provider of power semiconductor components and systems, are forming a 50/50 joint venture to develop and produce power electronics for future electric and hybrid vehicle applications. Magna Electronics, an operating unit of Magna International Inc. Earlier post.)

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DOE releases SBIR/STTR FY16 Phase 1 Release 2 topics; hydrogen, electric vehicles, more efficient combustion engines; biogas-to-fuels

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The first hydrogen TTO is focused on durable, high activity electrocatalyst with low platinum content and low cost for polymer electrolyte membrane fuel cell applications. The second TTO is focused on safety sensors for hydrogen infrastructure applications.

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Inkjets Are for More Than Just Printing

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Surpassing the visions of its creators, the inkjet technology used in these printers has found a host of applications beyond putting dots on paper. Piezoelectric devices rely on how some materials, such as ceramic lead-zirconate-titanate (PZT), change shape when subjected to a voltage. Each drop of ink may be just 1.5 Rinse and repeat.

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