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Microchip introduces first automotive-grade LIN SiP with touch hardware support

Green Car Congress

LiN systems are used throughout the automobile in comfort, powertrain, sensor, and actuator applications. The system solution comes in a 7 × 7 mm QFN package, with wettable flanks ready for automatic optical solder inspection and is available with 16k, 32k or 64k Flash memory, up to 8 KB SRAM and 2 KB Read-While-Write Flash.

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