Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120 million nodes by 2020, driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.

Connected to an application processor or other system-on-chip (SoC) host, the TC9560XBG allows the host device to deliver audio, video, and data information through the 10/100/1000 Ethernet network in an automotive environment.

Connection to the host is achieved via PCI Express (PCIe), HSIC or Time Division Multiplex (TDM)/I2S for audio traffic. The IC’s RGMII/RMII3 interface connects to the Ethernet switch or PHY device, and both AVB and legacy traffic are supported. An on-chip ARM Cortex-M3 processor can perform system control and management. The chipset is housed in a 10x10mm LFBGA package.

Toshiba’s TC9560XBG Ethernet bridge is designed to simplify wiring throughout the vehicle, optimizing in-vehicle infotainment (IVI) systems and other automotive applications, including telematics/LTE modem modules using Ethernet/Ethernet-AVB, while providing connectivity to CAN and CAN-FD engine control units simultaneously.

The device will be AEC-Q1001 qualified to ensure performance in rigorous automotive environments.

Connecting complex automotive electronics with an industry-standard Ethernet protocol also contributes to cost savings, reduced harness weight and improved mileage. In addition, the TC9560XBG will be AEC-Q100 qualified to enable enhanced performance in physically demanding automotive environments.

Qualcomm’s Snapdragon 820AU and S602A processors and the X12 LTE Modem interface seamlessly with our new TC9560XBG IC. The combination of capabilities embodied in these products will enable an exceptional level of connectivity and functionality in vehicles with next-generation infotainment systems.

—Shardul Kazi, senior vice president, System LSI Group at TAEC

The Qualcomm Snapdragon 820A processor with X12 LTE Modem was developed to support the advanced connectivity, graphics, video, power, and battery efficiency needed for automotive solutions. The processor integrates a new custom 64-bit quad-core Qualcomm Kryo CPU, the Qualcomm Adreno 530 GPU, as well as the Qualcomm Hexagon 680 DSP with Hexagon Vector eXtensions.

Qualcomm Technologies’ first generation automotive-grade infotainment processor, the Snapdragon 602A, was designed specifically to meet automotive industry standards and features the quad-core Qualcomm Krait CPU, Qualcomm Adreno 320 GPU, Qualcomm Hexagon DSP, integrated GNSS baseband processing and additional high-performance audio, video and communication cores.

The Snapdragon X12 LTE Modem, Qualcomm Technologies’ premier modem within the Snapdragon family, supports next-generation features such as LTE-Advanced Carrier Aggregation, LTE in unlicensed spectrum (LTE-U), and LTE + Wi-Fi Link Aggregation, representing the ultimate in connectivity.

Toshiba’s new Ethernet and CAN bridge chip is ideally suited as a companion to the capabilities of our Qualcomm Snapdragon processors and modems for infotainment and telematics applications.

—Nakul Duggal, vice president of product management, Qualcomm Technologies

The new Toshiba TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, are available now, with volume production slated to begin in October 2016. The Qualcomm Snapdragon 820A processor utilizing Toshiba’s TC9560XBG IC is scheduled to go into production in the 2018 timeframe, with automotive samples available in Q1 2016. The Snapdragon 602A processor and X12 LTE modem are commercially available now.