Remove Available Now Remove Connect Remove International Remove Standards
article thumbnail

HARMAN introduces range of connected vehicle technologies and Microsoft partnership at CES

Green Car Congress

HARMAN International Industries made a number of connected vehicle technology announcements during CES 2016 last week, including a connected car computing platform, demonstrated in the Rinspeed Σtos concept car; an advanced navigation system with live data fusion; an open cloud-based software delivery system; and a new partnership with Microsoft.

Connect 150
article thumbnail

Infineon introduces first Trusted Platform Module specifically for automotive cybersecurity

Green Car Congress

As a computer on wheels, the connected car benefits from the experience of the IT industry. It is easy to integrate and substantially increases cybersecurity—from production to recycling of connected cars. Technical information and availability. —Martin Brunner, expert for automotive security at Infineon.

ECC 334
article thumbnail

Renesas unveils automotive gateway based on new R-Car S4 SoCs and PMICs for next-gen vehicle computers; support for ISO/SAE 21434

Green Car Congress

and also a high-bandwidth 3 x 2.5Gbit Ethernet Switch to enable rich communication and connectivity options both inside and outside of the vehicle. allow a wide range of connectivity inside the vehicle. Samples of the R-Car S4 SoCs and evaluation boards are available now. Key Features of the R-Car S4 SoCs: Eight 1.2

Vehicles 221
article thumbnail

Renesas unveils Gen 3 R-Car system-on-chip for connected and autonomous cars

Green Car Congress

Furthermore, in in-vehicle infotainment systems, the need for connectivity between various systems and services such as smartphones and cloud services is growing. As the connection speed between the SoC and DDR memory rises, and the number of signal lines increases, burdens and complexities of PCB design increase.

Connect 150
article thumbnail

Nexperia announces 80% smaller automotive power MOSFET package

Green Car Congress

Nexperia, the former Standard Products division of NXP, announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. —Richard Ogden, International Product Marketing Engineer at Nexperia.

Power 150
article thumbnail

AeroVironment introducing new TurboDX charging station at CES

Green Car Congress

TurboDX incorporates a proprietary thermal management algorithm allowing for a connected vehicle to charge during high ambient temperature conditions, while continuously monitoring to ensure safe operation. TurboDX has been certified by international regulatory agencies for safety & security.

Charging 170
article thumbnail

Xilinx expands all programmable Artix-7 FPGA family with new automotive qualified devices

Green Car Congress

The XA family is well suited for automotive applications requiring advanced video processing, complex DSP operations, or bridging to the latest interface or networking standards. Gbit/s, enable customers to implement fully integrated connectivity solutions such as PCI Express Gen 2.